View GRM32ER71E226KE15L_6197215.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

1 nn30312a ver. ceb z high-speed response dc-dc step down regulator circuit that employs hy steretic control system z two 11 m ? (typ.) mosfets for high efficiency at 10 a z skip (discontinuous) mode for light load efficiency z up to 10 a output current z input voltagerange : avin : 4.5 v to 30 v, pvin : 4.5 v to 30 v, output voltage range : 0.75 v to 5.5 v selectable switching frequency 250 khz , 750 khz , 1250 khz z adjustable soft start z low operating and standby quiescent current z open drain power good indication for output over , under voltage z built-in under voltage lockout (uvlo), thermal shut down (tsd), over voltage detection (ovd), under voltage detection (uvd), over current protection (ocp), short circuit protection (scp) z hqfn040-a3-0606b ( size : 6 mm x 6 mm, 0.5 mm pitch ), 40pin plastic quad flat non-leaded package heat slug down (qfn type) high current distributed power systems such as ? hdds (hard disk drives) ? ssds (solid state drives) ? pcs ? game consoles ? servers ? security cameras ? network tvs ? home appliances ? oa equipment etc. simplified application applications features description vin = 4.5 v to 30 v, 10 a synchronous dc-dc step down regulator comprising of controller ic and power mosfet nn30312a is a synchronous dc-dc step down regulator (1-ch) comprising of a controller ic and two power mosfets and employs the hysteretic control system. by this system, when load current changes suddenly, it responds at high speed and minimizes the changes of output voltage. since it is possible to use capacitors with small capacitance and it is unnecessary to add external parts for system phase compensation, this ic realizes downsizing of set and reducing in the number of external parts. output voltage is adjustable by user. maximum current is 10 a. notes) this application circuit is an example. the operation of mass production set is not guaranteed. you should perform enough evaluation and verification on the design of mass production set. you are fully responsible for the incorporation of the above application circuit and information in the design of your equipment. condition ) v in = 12 v, vout = 1.05 v , 1.2 v , 1.8v , 3.3v , 5.0 v, l = 4.7 h, cout = 66 f ( 22 f x 3 ), frequency = 250 khz frequency = 250 khz 0 10 20 30 40 50 60 70 80 90 100 0.001 0.010 0.100 1.000 10.000 iout (a) efficiency (%) fccm/ vo= 1.05v fccm/ vo= 1.2v fccm/ vo= 1.8v fccm/ vo= 3.3v fccm/ vo= 5.0v skip/ vo= 1.05v skip/ vo= 1.2v skip/ vo= 1.8v skip/ vo= 3.3v skip/ vo= 5.0v vfb vreg en pgood bst lx pgnd agnd ss avin pvin vreg avin nn30312a pvin vout dcdcout 1.05 v 4.7 h 22 f 100k ? 22 f x 3 0.1 f 1.5k ? 1k ? 1 f 10nf 0.1 f 22 f 0.1 f efficiency curve publication date: october 2012
2 nn30312a ver. ceb absolute maximum ratings *1 v -0.3 to 6.0 en *1 *4 v ? 0.3 to ( v in + 0.3 ) lx *1 *3 v ? 0.3 to (vreg + 0.3) pgood output voltage range *1 *3 v ? 0.3 to (vreg + 0.3) mode,fsel,vout,vfb, input voltage range ? kv 2 hbm (human body model) esd *2 c ? 40 to + 150 t j operating junction temperature *2 c ? 55 to + 150 t stg storage temperature notes unit rating symbol parameter *2 c ? 40 to + 85 t opr operating free-air temperature *1 v 33 v in supply voltage notes) do not apply external currents and voltages to any pin not specifically mentioned. this product may sustain permanent damage if subjected to conditions higher than the above stated absolute maximum rating. this rating is the maximum rating and device operating at this range is not guaranteeable as it is higher than our stated recommended operating range. when subjected under the absolute maximum rating for a long time, the reliability of the product may be affected. v in is voltage for avin, pvin. avin = pvin. *1:the values under the condition not exceeding the above absolute maximum ratings and the power dissipation. *2:except for the power dissipation, operating ambient temperature, and storage temperature, all ratings are for ta = 25 c. *3:(vreg + 0.3) v must not be exceeded 6 v. *4:(v in + 0.3) v must not be exceeded 33 v. 1.47 w pd ( ta = 85 c) *1 2.82 w 44.2 c / w 40pin plastic quad flat non-leaded package heat slug down (qfn type) notes pd ( ta = 25 c) ja package power dissipation rating caution although this has limited built-in esd protection circuit, but permanent damage may occur on it. therefore, proper esd precautions are recommended to avoid electrostatic damage to the mos gates note). for the actual usage, please refer to the pd-ta characteristics diagram in the package specification, follow the power s upply voltage, load and ambient temperature conditions to ensure that there is enough margin and the thermal design does not exceed the allowable value. *1:glass epoxy substrate ( 4 layers ) [ glass-epoxy: 50 x 50 x 0.8 t ( mm ) ] die pad exposed , soldered.
3 nn30312a ver. ceb recommended operating conditions *2 v v in + 0.3 ? ?0.3 lx *1 v vreg + 0.3 ? ?0.3 mode ? v 30 12 4.5 pvin *1 v vreg + 0.3 ? ?0.3 fsel ? ? 12 typ. input voltage range ? v 6.0 ?0.3 en ?0.3 4.5 min. ? v 30 avin supply voltage range *1 v vreg + 0.3 pgood output voltage range notes unit max. pin name parameter note) do not apply external currents and voltages to any pin not specifically mentioned. voltage values, unless otherwise specified, are with respect to gnd. gnd is voltage for agnd, pgnd. agnd = pgnd v in is voltage for avin, pvin. avin = pvin. the values under the condition not exceeding the above absolute maximum ratings and the power dissipation. *1 : (vreg + 0.3) v must not be exceeded 6 v. *2 : (v in + 0.3) v must not be exceeded 33 v.
4 nn30312a ver. ceb ? mv 200 ? ? v in = 12 v to 6 v ivreg = ? 20 ma v regline vreg line regulation ? v 5.0 ? 1.5 ? v enh en pin high-level input voltage ? a 12.5 6.25 ? en = 5 v i leaken en pin leak current ? v vreg x 0.3 ? ? ? v model mode pin low-level input voltage ? v vreg ? vreg x 0.7 ? v modeh mode pin high-level input voltage ? a 12.5 6.25 ? mode = 5 v i leakmode mode pin leak current ? v 0.3 ? ? ? v model fsel pin low-level input voltage ? v 0.3 ? ? ? v enl en pin low-level input voltage ? v vreg ? vreg ?0.3 ? v modeh fsel pin high-level input voltage vreg logic pin current consumption ? a 2 ? ? en = 0 v i vddstb consumption current at standby ? a 25.0 15.0 ? fsel = 5 v i leakmd fsel pin leak current ? v ? ? 4.11 v in = 4.5 v ivreg = ? 20 ma v regdo vreg drop out voltage ? v 5.9 5.5 5.1 ivreg = ? 20 ma v regout vreg output voltage ? a 1000 650 ? en= 5 v, i out = 0 a rfb1 = 4.5 k ? rfb2 = 1.0 k ? mode=gnd (skip mode) i vddact consumption current at active limits typ unit max note min condition symbol parameter elecrtrical characteristics co = 22 f x 3 (murata), lo= 1 h (tdk), vout setting = 3.3 v, v in = av in = pv in = 12 v, switching frequency = 750 khz, mode = vreg (fccm), t a = 25 c 2 c unless otherwise noted.
5 nn30312a ver. ceb ? ? 15 10 ? ? rpg pgood on resistance ? % 6.5 5.0 3.5 pgood : low to high v hyspg2 pgood hysteresis 2 (vfb ratio for ovd release) ? % 123 115 107 pgood : high to low v thpg2 pgood threshold 2 (vfb ratio for ovd detect) ? % 6.5 5.0 3.5 pgood : low to high v hyspg1 pgood hysteresis 1 (vfb ratio for uvd release) ? % 93 85 77 pgood : high to low v thpg1 pgood threshold 1 (vfb ratio for uvd detect) pgood ? v 4.5 4.2 3.9 v in = 0 v to 5 v v uvlormv uvlo recover voltage 1 ? v 4.1 3.8 3.5 v in = 5 v to 0 v v uvlodet uvlo start voltage 1 under voltage lock out vfb characteristics ? v 0.606 0.600 0.594 ? v fbts vfb comparator threshold limits typ unit max note min condition symbol parameter elecrtrical characteristics ( continued ) co = 22 f x 3 (murata), lo= 1 h (tdk), vout setting = 3.3 v, v in = av in = pv in = 12 v, switching frequency = 750 khz, mode = vreg (fccm), t a = 25 c 2 c unless otherwise noted.
6 nn30312a ver. ceb ? a 1 ? ?1 vfb = 6 v i leakfb2 ? a 1 ? ?1 vfb = 0 v i leakfb1 vfb pin leak current 2 vfb pin leak current 1 vfb characteristics dc-dc *1 ? %/v 0.75 0.25 ? pvin = 6v to 30 v i out = ? 0.5 a dd regin dc-dc line regulation *1 % ? 3.5 ? i out = ? 10 ma to ? 10 a dd regld dc-dc load regulation *1 % ? 65 ? i out = ? 10 ma mode=gnd (skip mode) dd eff1 dc-dc efficiency 1 *1 % ? 88 ? i out = ? 5a dd eff2 dc-dc efficiency 2 *1 mv [p-p] ? 20 ? i out = ? 10 ma dd vrpl1 dc-dc output ripple voltage 1 *1 mv [p-p] ? 20 ? i out = ? 5a dd vrpl2 dc-dc output ripple voltage 2 *1 mv ? 20 ? i out = ? 100 ma ? ?1.5 a vout = 1 v t = 0.5 a / s dd dvac dc-dc load transient response ? m ? 22 11 ? vgs = 5.5 v dd ronh dc-dc high side mos on resistance ? m ? 22 11 ? vgs = 5.5 v dd ronl dc-dc low side mos on resistance v ? 2.5 ? dv = pvin ? vout dv min input and out put voltage difference limits typ unit max note min condition symbol parameter elecrtrical characteristics ( continued ) co = 22 f x 3 (murata), lo= 1 h (tdk), vout setting = 3.3 v, v in = av in = pv in = 12 v, switching frequency = 750 khz, mode = vreg (fccm), t a = 25 c 2 c unless otherwise noted. *1 typical value checked by design.
7 nn30312a ver. ceb ? % 70 60 50 fb = 0.6 v to 0.0 v dd shpth *1 a ? 15.0 ? ? dd ilmt dc-dc output gnd short protection threshold dc-dc output current limit protection ? k ? 10 5 ? en = 0 v r ssdis ? a ? ?2 ?4 v ss = 0.3 v i sschg ss discharge resistance (shut-down) ss charge current soft-start timing *1 khz ? 1250 ? i out = ? 5 a dd fsw3 dc-dc switching frequency 3 *1 *1 switching frequency adjustment khz ? 250 ? i out = ? 5 a dd fsw1 dc-dc switching frequency 1 khz ? 750 ? i out = ? 5 a dd fsw2 dc-dc switching frequency 2 limits typ unit max note min condition symbol parameter elecrtrical characteristics ( continued ) co = 22 f x 3 (murata), lo= 1 h (tdk), vout setting = 3.3 v, v in = av in = pv in = 12 v, switching frequency = 750 khz, mode = vreg (fccm), t a = 25 c 2 c unless otherwise noted. *1 typical value checked by design.
8 nn30312a ver. ceb pin configuration top view 16 11 14 16 21 26 31 32 36 42 pvin 41 agnd 43 lx 33 34 35 25 24 23 22 15 12 13 5 4 3 2 pgnd lx mode agnd avin fsel en vreg vfb vout ss pgood agnd bst pvin 10 9 8 7 18 20 19 17 30 29 28 27 39 37 38 40 pgnd n.c n.c n.c n.c n.c pin functions 17 12 13 14 15 16 7 8 power mosfet output pin output lx 1 5 4 2 11 10 ground pin for power mosfet ground pgnd 9 6 3 description type pin name pin no. notes) concerning detail about pin description, please refer to operation and application information section.
9 nn30312a ver. ceb pin functions ( continued ) skip / fccm mode select pin input mode 18 ground pin ground agnd 19 power supply pin power supply avin 20 no connection pin (don?t use pin) - n.c. 21 40 37 38 39 36 power supply pin for power mosfet power supply pvin no connection pin (don?t use pin) - 35 ground pin ground agnd 32 30 on/off control pin input en frequency selection pin input fsel supply input pin for high side fet gate driver output bst 33 n.c. 34 ground pin for radiation of heat ground agnd 41 power supply pin for radiation of heat power supply pvin 42 soft start capacitor connect pin output ss 28 no connection pin (don?t use pin) - n.c. 29 power good open drain pin output pgood 31 power mosfet output pin for radiation of heat output lx 43 output voltage sense pin input vout 27 comparator negative input pin input vfb 26 ldo output pin (power supply for internal control circuit) output vreg 25 24 22 23 description type pin name pin no. notes) concerning detail about pin description, please refer to operation and application information section.
10 nn30312a ver. ceb functional block diagram notes) this block diagram is for explaining functions. part of the block diagram may be omitted, or it may be simplified. control logic soft-start vin 0.6 v vref hgate uvlo scp ocp tsd ref on cmp toff timer + comp ton timer + comp fccm / skip 0.6 v + 15 % 0.6 v ? 15 % aux timer coast fault vreg : 5.5 v on / off soft-start ss vreg bgr vint vbg en hpd hgo lpd lgo lgate vreg vout vfb fsel mode vreg agnd ss avin pgood bst lx pgnd pvin 35,36,37,38,39,40,42 31 33 1,2,3,4,5,6,7,8,43 9,10,11,12,13,14,15,16,17 19,32,41 18 26 27 25 23 24 28 20
11 nn30312a ver. ceb operation 1. protection ( 1).output over-current protection (ocp) function and short-circuit protection (scp) function 1) the over current protec tion is activated at about 15 a (typ.) during the ocp, t he output voltage continues to drop at the specified current. 2) the short-circuit protecti on function is implemented when the output voltage decreases and the vfb pin reaches to about 60 % of the set voltage of 0.6 v. 3) the scp operates intermittently at 2 ms-on, 16 ms off intervals. fccm high skip low mode mode pin (2).switching frequency setting the ic can operate at three different frequency : 1250 khz, 750 khz and 250 khz. the switching frequency can be set by fsel pin as follows. 750 open high low fsel pin 1250 250 frequency [khz] 2. pin setting (1).operating mode setting the ic can operate at two different modes : skip mode and forced continuous conduction mode (fccm). in skip mode, the ic is working under pulse skipping mechanism to improve efficiency at light load condition. in fccm mode, the ic is working at fixed frequency to avoid emi issues. the operating mode can be set by mode pin as follows. (3).thermal shut down (tsd) when the ic internal temperature becomes more than about 130 c, tsd operates and dcdc turns off. (2).over voltage detection (ovd) and under voltage detection (uvd) 1).the nmos connected to the pgood pin turns on when the output voltage rises and the vfb pin voltage reaches 115 % of its set voltage (0.6 v). 2).after (1) above, the nmos connected to the pgood pin is turned off after 1 ms when the output voltage drops and the vfb pin voltag e reaches 110 % of its set voltage (0.6 v). 3).the nmos connected to the pgood pin turns on when the output voltage drops and the vfb pin voltage reaches 85 % of its set voltage (0.6 v). 4).after (3) above, the nmos connected to the pgood pin is turned off after 1 ms when the output voltage drops and the vfb pin voltage reaches 90 % of its set voltage (0.6 v). figure : ocp and scp operation output current [a] pendency characteristics (ground short protection detection about 60% of vout ) intermittent operation area over current protection ( typ : 15 a ) ground short protection hysteresis output voltage [v] about 2 a 1) 2) 3) note) the characteristics listed below are reference values derived from the design of the ic and are not guaranteed. figure : ovd and uvd operation 115 % 110 % 90 % 85 % 0.6 v 0.6 v vfb pgood 1 ms 1 ms note: pgood pin is pulled up to vreg pin 1) 2) 3) 4) 10.5 a to 20.5 a
12 nn30312a ver. ceb operation ( continued ) 3. output voltage setting the output voltage can be set by external resistance of fb pin, and its calculation is as follows. (vin = 12 v, iout = 0 a, fccm, fsw = 750 khz). below resistors are recommended for following popular output voltage. 1.0 k 2.0 k 1.8 1.5 k 1.0 k 1.0 1.0 k 1.5 k rfb2 [ ? ] 4.5 k 3.3 11.0 k 5.0 rfb1 [ ? ] vout [v] note: rfb2 can be set to a maximum value of 10 k ? . a larger fbr2 value will be more susceptible to noise. vfb comparator threshold is adjusted to 1 %, but the actual output voltage accuracy becomes more than 1 % due to the influence from the circuits other than vfb comparator. in the case of vout setting = 3.3 v, the actual output voltage accuracy becomes 2.5 %. (vin = 12 v, iout = 0 a, fccm, fsw = 750 khz). when css is set at 10 nf, soft-start time is approximately 3ms. css time start soft = 2 6 . 0 (sec) en ss vout vfb 0.6 v soft start time (s) figure : soft start operation uvlo vreg 4.2 v 4. soft start setting soft start function maintains the smooth control of the output voltage during start up by adjusting soft start time. when the en pin becomes high, the current (2 a) begin to charge toward the external capacitor (css) of ss pin, and the vo ltage of ss pin increases straightly. because the voltage of fb pin is controlled by the voltage of ss pin during star t up, the voltage of fb increase straightly to the regulation voltage (0.6 v) together with the voltage of ss pin and keep the regulation voltage after tha t. on the other hand, the voltage of ss pin increase to about 2.8 v and keep the voltage. the calculation of soft start time is as follows. note) the characteristics listed below are reference values derived from the design of the ic and are not guaranteed. vout = ( 1 + ) 0.6 rfb1 rfb2 vout rfb1 vfb (0.6 v) rfb2
13 nn30312a ver. ceb operation ( continued ) 5. start-up / shut-down settings the start-up / shut-down is enabled by the en pin. the en pin can be set by either applying voltage from an external voltage source or through a resistor connected to the avin pin. case 1: setting up the en pin using an external voltage source. when an external voltage source is used, the en pin input voltage (venh, venl) should satisfy the conditions as defined in the electrical characteristics case 2: setting up the en pin through a resistor connected to avin pin. when setting up the en pin through a resistor connected to the avin pin, refer to equations (1) and (2) to calc ulate the optimal resistor settings. equation (1) : ren1 > id avin ? vd equation (2) : ren1 < venh (avin ? venh) ren2 100 a 12 v ? 6 v = 60 k ? 5 v (12 v ? 5 v) 400 k ? = 560 k ? equation (1) : ren1 > equation (2) : ren1 < 6. power on / off sequence (1) when the en pin is set to high after the vin settles, the bgr and the vreg start-up. (2) when the vreg pin exceeds its threshold value, the uvlo is released and the soft start sequence is enabled. the capacitor connected to the ss pin begins to charge and the ss pin voltage increases linearly. (3) the vout pin (dc-dc output) voltage increases at the same rate as the ss pin. normal operation begins after the vout pin reaches the set voltage. (4) when the en pin is set to ?low?, the bgr, vreg and uvlo stop operation. the vout pin / ss pin voltage starts to drop and the vout pin discharge time depends on the value of the feedback resistors and the output load current. note: the ss pin capacitor should be discharged completely before restarting the startup sequence. an incomplete discharge process might result in an overshoot of the output voltage. v in uvlo ss vout vreg 4.2 v (1) (2) (3) (4) vfb 0.6 v en pgood 2 delay time (s) = 0.09 css + 1 m figure : power on/off sequence 0 v 5 v (max.) avin vreg 24 en figure : internal ci rcuit with en pin avin vreg 24 avin en ren1 500 ren2 : 800 k ? 50 % vd : 5.7 v 0.3 v id : more than 100 a figure : internal ci rcuit with en pin note) the characteristics listed below are reference values derived from the design of the ic and are not guaranteed. 2 soft start time (s) = 0.6 css
14 nn30312a ver. ceb operation ( continued ) 7. inductor and output capacitor setting il io ic 0 0 eo S il/2 ton t=1/f vo S il/2 vrpl q2 q1 vo(eo) lo co il ei io ic rc given the desired input and ou tput voltages, the inductor value and operating frequency determine the ripple current. 2 il iox = () f lo ei eo ei eo il ? ? ? ? = highest efficiency operation is obtained at low frequency with small ripple current. however, achieving this requires a large inductor. there is a trade-off among component size, efficiency and operating frequency. a reasonable starting point is to choose a ripple current that is about 40 % of iout(max). the largest ripple current occurs at the highes t vin. to guarantee that ripple current does not exce ed a specified maximum, the inductance should be chosen according to: () ei_max ei @ 2 = ? ? ? ? f iox ei eo ei eo lo and its maximum current rating is ei_max) ei (@ 2 io_max _max = + = il il the selection of cout is primarily determined by the esr (rc) required to minimize voltage ripple and load transients. the output ri pple vrpl is approximately bounded by: () 2 2 2 8 2 8 2 f co lo ei eo ei eo lo rc co ei f co il lo rc co ei vob vop vrpl ? ? ? ? ? + ? ? = ? + ? ? = ? = from the above equation, to achieve desired output ripple, low esr ceramic capacitors are recommended, and its required rms current rating is: ei_max) ei (@ 3 2 (rms)_max = = il ic note) the characteristics listed below are reference values derived from the design of the ic and are not guaranteed.
15 nn30312a ver. ceb typical characteristics curves (1) output ripple voltage condition : vin=12v,vout = 1.05v,frequency = 750khz,skip mode i load = 0a i load = 3a i load = 6a i load = 10a vout lx vout lx vout lx vout lx
16 nn30312a ver. ceb (1) output ripple voltage condition : vin=12v,vout = 1.05v,frequency = 750khz,fccm mode i load = 0a i load = 3a i load = 6a i load = 10a vout lx vout lx vout lx vout lx typical characteristics curves ( continued )
17 nn30312a ver. ceb typical characteristics curves ( continued ) (2) load transient time (100 us/div) vout (50 mv/div) iout (10 a/div) 10.5mv 16.5mv time (100 us/div) vout (50 mv/div) iout (10 a/div) 10.5mv 11mv condition : vin = 12 v, vout = 1.05 v, frequency = 750 khz, iout = 10 ma ?? 10 a ( 0.5 a / s ) skip mode fccm mode (3) efficiency time (100 us/div) vout (50 mv/div) iout (10 a/div) 10mv 9.5mv time (100 us/div) vout (50 mv/div) iout (10 a/div) 10.5mv 10mv condition : vin = 12 v, vout = 1.05 v, frequency = 750 khz, iout = 1 a ?? 10 a ( 0.4 a / s ) skip mode fccm mode condition : vin = 12 v, vout = 1.05 v / 1.2 v / 1.8v / 3.3v / 5.0 v, l = 4.7 h, cout = 66 f (22 f x 3), frequency = 250 khz frequency = 250 khz 0 10 20 30 40 50 60 70 80 90 100 0.001 0.010 0.100 1.000 10.000 iout (a) efficiency (%) fccm/ vo= 1.05v fccm/ vo= 1.2v fccm/ vo= 1.8v fccm/ vo= 3.3v fccm/ vo= 5.0v skip/ vo= 1.05v skip/ vo= 1.2v skip/ vo= 1.8v skip/ vo= 3.3v skip/ vo= 5.0v frequency = 750 khz 0 10 20 30 40 50 60 70 80 90 100 0.001 0.010 0.100 1.000 10.000 iout (a) efficiency (%) fccm/ vo= 1.05v fccm/ vo= 1.2v fccm/ vo= 1.8v fccm/ vo= 3.3v fccm/ vo= 5.0v skip/ vo= 1.05v skip/ vo= 1.2v skip/ vo= 1.8v skip/ vo= 3.3v skip/ vo= 5.0v condition : vin = 12 v, vout = 1.05 v / 1.2 v / 1.8v / 3.3v / 5.0 v, l = 1 h, cout = 66 f (22 f x 3), frequency = 750khz
18 nn30312a ver. ceb (4) load regulation (5) line regulation load regulation_f = 250khz (skip mode) 1.000 1.020 1.040 1.060 1.080 1.100 0 1 2 3 4 5 6 7 8 9 10 iout (a) vout (v) load regulation_f = 250khz (fccm mode) 1.000 1.020 1.040 1.060 1.080 1.100 0 1 2 3 4 5 6 7 8 9 10 iout (a) vout (v) load regulation_f = 750khz (skip mode) 1.000 1.020 1.040 1.060 1.080 1.100 0 1 2 3 4 5 6 7 8 9 10 iout (a) vout (v) load regulation_f = 750khz (fccm mode) 1.000 1.020 1.040 1.060 1.080 1.100 0 1 2 3 4 5 6 7 8 9 10 iout (a) vout (v) condition : vin = 12 v, vout = 1.05 v, frequency = 250 khz condition : vin = 12 v, vout = 1.05 v, frequency = 750 khz line regulation_f = 750khz (skip mode) 0.00 0.20 0.40 0.60 0.80 1.00 1.20 1.40 0 5 10 15 20 25 30 vin (v) vout (v) line regulation_f = 750khz (fccm mode) 0.00 0.20 0.40 0.60 0.80 1.00 1.20 1.40 0 5 10 15 20 25 30 vin (v) vout (v) condition : vin = 12 v, vout = 1.05 v, frequency = 750 khz, iout = 1.5 a typical characteristics curves ( continued )
19 nn30312a ver. ceb (6) start/shut down en vout ss time = 10ms/div time = 10ms/div en vout ss en vout ss time = 10ms/div time = 10ms/div en vout ss en vout ss time = 10ms/div time = 10ms/div en vout ss en vout ss time = 10ms/div time = 10ms/div en vout ss condition : vin = 12 v, vout = 1.05 v, frequency = 750 khz, skip mode, iout = 0 a condition : vin = 12 v, vout = 1.05 v, frequency = 750 khz, fccm mode, iout = 0 a condition : vin = 12 v, vout = 1.05 v, frequency = 750 khz, skip mode, rload = 0.5 ? condition : vin = 12 v, vout = 1.05 v, frequency = 750 khz, fccm mode, rload = 0.5 ? typical characteristics curves ( continued )
20 nn30312a ver. ceb (7) short current protection lx vout ss time = 10ms/div iout time = 10ms/div lx vout ss iout condition : vin = 12 v, vout = 1.05 v, frequency = 750 khz skip mode fccm mode (8) switching frequency typical characteristics curves ( continued ) lx average frequency (mhz) skip mode 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 0.01 0.1 1 10 iload (a) lx average frequency (mhz) lx average frequency (mhz) fccm mode 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 0.01 0.1 1 10 iload (a) lx average frequency (mhz) lx average frequency (mhz) skip mode 0.50 0.55 0.60 0.65 0.70 0.75 0.80 0.85 0.90 4 6 8 1012141618202224262830 vin(v) lx average frequency (mhz) lx average frequency (mhz) fccm mode 0.50 0.55 0.60 0.65 0.70 0.75 0.80 0.85 0.90 4 6 8 1012141618202224262830 vin(v) lx average frequency (mhz) condition : vin = 12 v, vout = 1.05 v, frequency = 750 khz, iout = 10 ma ~ 10 a condition : vout = 1.05 v, frequency = 750 khz, iout = 5 a
21 nn30312a ver. ceb (9) thermal performance typical characteristics curves ( continued ) condition : vin=12v , vout = 1.05v , frequency = 750khz , iload = 6a , fccm mode
22 nn30312a ver. ceb applications information condition : vout = 3.3 v, frequency = 750 khz, skip mode c-pvin5 c-pvin6 pgnd vout c-dcdcout1 c-dcdcout2 c-dcdcout3 l-lx c-avin1 c-avin2 c-pvin5 c-pvin6 r-fbx r-fbx vfb lx pvin avin vout c-bst ss c-vreg 11 14 17 18 19 20 23 24 25 26 27 28 31 32 33 35 37 39 13 5678 pgnd fsel l-lx r-fb3 r-fb2 c-dcdcout1 c-dcdcout2 c-dcdcout3 r-fb4 r-fb1 lx bst mode agnd avin en vreg vfb vout ss pgood agnd pvin c-avin1 c-avin2 c-bst dcdcout r-pg pvin avin c-ss en c-vreg vout 2 4 16 15 13 12 10 9 36 38 40 figure : application circuit figure : layout figure : top layer with silk screen ( top view ) with evaluation board figure : bottom layer with silk screen ( bottom view ) with evaluation board nn30312a notes) this application circuit and layout is an example. the opera tion of mass production set is not guaranteed. you should perform enough evaluation and verification on the design of mass production set. you are fully responsible for the incorporation of the above application circuit and information in the design of your equipment.
23 nn30312a ver. ceb applications information ( continued ) ? ? ? ? ? fsel vreg ( 250 khz ) fsel gnd ( 1250 khz ) open ( 750 khz ) ? ? ? ? ? ? ? ? note fda1254-4r7m toko 4.7 h 100 k ? 0 1.0 k ? 1.2 k ? 3.3 k ? 1.0 h 1.0 f 10 nf 0.1 f 10 f 22 f 0.1 f 0.1 f 10 f value 1 1 1 1 1 1 1 1 1 2 3 1 1 2 qty erj3ekf3301v panasonic r-fb1 erj3ekf1201v panasonic r-fb2 erj3ekf1001v panasonic r-rb3 erj3gey0r00v panasonic r-fb4 spm6530-1r0m120 tdk l-lx grm188r71e105ka12l murata c-vreg grm188r72a103ka01l murata c-ss umk325ab7106mm-t taiyo yuden c-pvin5 grm188r72a104ka35l murata c-pvin6 GRM32ER71E226KE15L murata c-dcdcout grm188r72a104ka35l murata c-bst umk325ab7106mm-t taiyo yuden c-avin1 grm188r72a104ka35l murata c-avin2 erj3ekf1003v panasonic r-pg part number manufacturer reference designator figure : recommended component
24 nn30312a ver. ceb package information ( reference data ) outline drawing unit : mm
25 nn30312a ver. ceb package information ( reference data ) power dissipation (supplementary explanation)
26 nn30312a ver. ceb important notice 1.the products and product specificat ions described in this book are subject to change without notice for modification and/or improvement. at the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date product standards in advance to ma ke sure that the latest specifications satisfy your requirements. 2.when using the lsi for new models, verify the safe ty including the long-term reliability for each product. 3.when the application system is designed by using this lsi, be sure to confirm notes in this book. be sure to read the notes to descr iptions and the usage notes in the book. 4.the technical information described in this book is inten ded only to show the main characteristics and application circuit examples of the products. no license is granted in and to any intellectual property right or other right owned by panasonic corporation or any other company. therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information de-scribed in this book. 5.this book may be not reprinted or r eproduced whether wholly or partially, without the prior written permission of our company. 6.this lsi is intended to be used for general electronic equipment. consult our sales staff in advance for information on the following applications: special applications in which exceptional quality and reliability are required, or if the failu re or malfunction of this lsi may directly jeopardize life or harm the human body. any applications other than t he standard applications intended. (1) space appliance (such as artificial satellite, and rocket) (2) traffic control equipment (such as fo r automobile, airplane, train, and ship) (3) medical equipment for life support (4) submarine transponder (5) control equipment for power plant (6) disaster prevention and security device (7) weapon (8) others : applications of which reliabili ty equivalent to (1) to (7) is required it is to be understood that our company sh all not be held responsible for any damage incurred as a result of or in connection with your using the lsi described in this book for any special application, unless our company agrees to your using the lsi in this book for any special application. 7.this lsi is neither designed nor intended for use in aut omotive applications or envir onments unless the specific product is designated by our company as comp liant with the iso/ts 16949 requirements. our company shall not be held responsible for any damage incurred by you or any third party as a result of or in connection with your using the lsi in aut omotive application, unless our compan y agrees to your using the lsi in this book for such application. 8.if any of the products or technical in formation described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially , those with regard to security export control, must be observed. 9. please use this product in compliance with all applicable la ws and regulations that regula te the inclusion or use of controlled substances, including withou t limitation, the eu rohs directive. our company shall not be held responsible for any dama ge incurred as a result of your using the lsi not complying with the applicable laws and regulations.
27 nn30312a ver. ceb usage notes 1. when designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc. ). especially, please be careful not to exceed the range of absolute maximum rati ng on the transient state, such as power-on, power-off and mode-switching. otherwise, we will not be liable for any defect which may arise later in your equipment. even when the products are used within the guaranteed val ues, take into the consideration of incidence of break down and failure mode, possible to occur to semi conductor products. measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are reco mmended in order to prevent physical injury, fire, social damages, for example, by using the products. 2. comply with the instructions for use in order to pr event breakdown and characteristics change due to external factors (esd, eos, thermal stress and mechanical stress) at the time of handling, mo unting or at customer's process. when using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. 3. pay attention to the direction of lsi. when mounting it in the wrong directi on onto the pcb (printed-circuit-board), it might smoke or ignite. 4. pay attention in the pcb (printed-circuit-board) pattern layout in order to prevent damage due to short circuit between pins. in addition, refer to the pin description for the pin configuration. 5. perform a visual inspection on the pcb before applying power, otherwise damage might happen due to problems such as a solder-bridge between the pins of t he semiconductor device. also, perform a full technical verification on the assembly quality, because the same damage possibly can happen due to conductive substances, such as solder ball, that adhere to the lsi during transportation. 6. take notice in the use of this pr oduct that it might break or occasionally smoke when an abnormal state occurs such as output pin-vcc short (power supply fault), out put pin-gnd short (ground faul t), or output-to-output-pin short (load short) . and, safety measures such as an installation of fuses are recommended becaus e the extent of the above- mentioned damage and smoke emission will depend on the current capability of the power supply. 7. the protection circuit is for maintaining safety agai nst abnormal operation. theref ore, the protection circuit should not work during normal operation. especially for the thermal protection ci rcuit, if the area of safe operation or the absolute maximum rating is momentarily exceeded due to output pin to vcc short (pow er supply fault), or output pin to gnd short (ground fault), the lsi might be damaged before t he thermal protection circuit could operate. 8. unless specified in the product specifications, make sure that negative voltage or excessive voltage are not applied to the pins because the device might be damage d, which could happen due to negative voltage or excessive voltage generated during the on and off timing when the inductive load of a motor coil or actuator coils of optical pick-up is being driven. 9. the product which has spec ified aso (area of safe oper ation) should be operated in aso 10. verify the risks which might be caused by the malfunctions of external components. 11. connect the metallic plates on the back side of the lsi with their respecti ve potentials (agnd, pvin, lx). the thermal resistance and the electrical characteristics ar e guaranteed only when the meta llic plates are connected with their respective potentials.
request for your special attention and precautions in using the technical information and semiconductors described in this book (1) if any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) the technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. no license is granted in and to any intellectual property right or other right owned by panasonic corporation or any other company. therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) the products described in this book are intended to be used for general applications (such as office equipment, communications equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book. consult our sales staff in advance for information on the following applications: ? special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. it is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with your using the products described in this book for any special application, unless our company agrees to your using the products in this book for any special application. (4) the products and product specifications described in this book are subject to change without notice for modification and/or im- provement. at the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date product standards in advance to make sure that the latest specifications satisfy your requirements. (5) when designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. otherwise, we will not be liable for any defect which may arise later in your equipment. even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (esd, eos, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. when using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) this book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 20100202

▲Up To Search▲

Price & Availability of GRM32ER71E226KE15L

	To Download GRM32ER71E226KE15L Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .